OCZ Technology has released a new DDR2 and DDR3 ReaperX memory kit, after releasing the Reaper HPC not long time ago. The two high-speed, high-capacity memory products are designed with hardcore gamers in mind. The latest OCZ PC3-10666 and PC2-8000 ReaperX 4GB memory kits feature the ideal blend of speed, latency, bandwidth, and up to 4GB capacities to help DirectX-10 PC games reach their full potential on the latest DDR2 and DDR3 platforms.
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Walton Chaintech has released its brand-new APOGEE GT DDR3 memory module rated at a blazing-fast 1800MHz (PC3-14400). It is tested and qualified to reach DDR3 1800 with substantial overclocking capbility and aggressive latencies, APOGEE GT DDR3 1800 memory modules are rated to run CL8-8-8-24 and optimized for the latest Intel P35 and X38 chipset. APOGEE GT DDR3 1800MHz Non-ECC Unbuffered DIMM is actually made of 8 pieces, Micron D9G 128Mx8 chips, which are well known for their exceptional overclocking performance. Each chip is handpicked for meeting strict performance and quality requirements. Not only that, all chips are manufactured of using Fine-Pitch Ball Grid Array (FBGA) packages to assure better thermal dissipation and electrical efficiency.
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The memory modules manufacture, Transcend, has released its latest professional-grade 2GB DDR2-667 VLP (Very Low Profile) Registered memory modules. This DIMMs uses robust eight-layer PCBs with a height of only 0.72-inch which still meets JEDEC (Joint Electron Device Engineering Council) standards, and can be used in low profile and normal-height systems. With the height 40% lower than standard memory modules, making them appropriate for use in 1U blade servers and embedded systems with space restrictions.
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OCZ Technology has released another new memory module that is specifically designed and engineered for platforms powered by Intel chipsets, the new PC2-8500 DDR2 Titanium modules. With the clock speed at 1066MHz, the OCZ PC2-8500 Titanium modules will be available in 1024MB densities and 2GB (2×1024MB) dual channel kits. Each memory module features a proprietary titanium mirrored XTC (Xtreme Thermal Convection) heat spreader for the most effective heat dissipation. Each OCZ PC2-8500 Titanium module is 100% hand-tested for quality assurance and compatibility with and is backed by an industry leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind.
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Super Talent Technology has announced the immediate availability of the world’s most advanced DDR3 memory kits, dubbed Project X. These two Super Talent Project X Kits W1800UX2GP DDR3-1800 PC3-14400 2GB Kit (2x 1GB) and W1600UX2GP DDR3-1600 PC3-12800 2GB Kit (2x 1GB) are built with the fastest available, carefully screened DRAM chips, and are hand tested as a matched pair on a dual channel Asus P5K3 Deluxe motherboard. Project X employs an extreme cooling solution that offers double the surface area and 106% more aluminum mass than standard heat spreaders. With Super Talent’s special thermal adhesive, this cooling solution provides superior heat dissipation that result in a cooler, faster memory device. Super Talent Project X memory combines blistering fast clock speeds with aggressively tuned latencies.
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A company from Taiwan, G.Skill has announced its latest DDR3-1600 CL7-7-7-18 (F3-12800CL7D-2GBHZ) memory modules for high end enthusiasts looking for extra power. Available in pair of 2×1GB modules the memory offers lifetime warranty. Intel has optimized certain chipsets for G.Skill’s latest DDR3 memory.

“As the main extreme memory provider, we always try to create the world 1st specification to meet forerunner’s request. We have done much in DDR1 and DDR2 and we will keep working hard in DDR3.”, said Johnson Huang, G.Skill CEO.

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OCZ Technology has announced the latest edition to the highly-awarded OCZ Reaper HPC (Heat Pipe Conduit) product family, PC2-6400 Reaper HPC CL3 series. The newest Reaper series is engineered to produce significant performance gains on the latest NVIDIA nForce platforms by implementing Enhanced Performance Profiles (EPP) and allowing the memory to operate at a stable 800MHz at CL3 upon start-up. The Reaper HPC is an innovative patent-pending cooling solution developed by OCZ to effectively minimize heat produced by high-speed memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminum fin array. By guiding performance-robbing heat away from key memory components, the unique Reaper HPC design helps facilitate improved overclocking performance, while improving longevity and stability of the modules.
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OCZ Technology has come out its exclusively designed PC2-5400 Titanium module for AMD AM2 platform, and it’s custom-tailored to the extended column address range of the AM2 memory controller. The module comes with a doubled page size to reduce the access penalties for ultimately system performance improvement. On the AM2 platform, the architecture of these modules is particularly beneficial for large CAD model processing and memory intense graphics applications such as filters in Adobe Photoshop or video processing.
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